Summary:
Electrical characterization of the SiNx/InGaAs and SiNx/Si interfaces was carried out by high?frequency capacitance?voltage (C?V) measurements (1 MHz). Two impurity levels, regardless of substrate nature, have been identified and attributed to silicon dangling bond defects, such as 3/4 Si0 and 3/4 Si?. Electron spin resonance measurements, carried out both at room temperature and at 77 K, confirmed the presence of defects such as 3/4 Si0 surrounded by Si bonds.
JCR Impact Factor and WoS quartile: 4,000 - Q2 (2022)
DOI reference:
https://doi.org/10.1063/1.103109
Published on paper: April 1990.
Published on-line: June 1998.
Citation:
A. Piccirillo, A.L. Gobbi, M. Ferraris, R. Giannetti, P.E. Bagnoli, Identification of silicon nitride/InGaAs interface states. Applied Physics Letters. Vol. 56, nº. 17, pp. 1661 - 1663, April 1990. [Online: June 1998]
